Reference Number: DEVCOM-103
Project Description
The U.S. DEVCOM Army Research Laboratory (ARL) is pleased to announce an exciting opportunity for a summer internship with a focus on microsystems, ferroelectrics, 2.5D integration and MEMS. Responsibilities will include: 1. Piezoelectric sensor fabrication; 2. Advanced electronics packaging including chip to chip bonding; 3. Electrical characterization and testing; and 4. communicating and presenting research findings to ARL team. The successful candidate will primarily be stationed in Adelphi, Maryland.
Technical Skills
- Experience in material processing labs, cleanroom, and/or materials characterization lab
- Experience with microfabrication processes, specific to MEMS.
- Experience with IC packaging, chip to chip bonding and multichip packaging techniques
- Experience with IC design, and basic circuitry.
- Experience with MEMS applications and testing.
- Experience with COMSOL or relevant, mechanical modeling tools.
